Technology
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Selective Material Removal & Deposition
RAP’s chemistry can be modified to attack specific materials on a surface, such as contaminants, debris and unwanted coatings. We have engineered RAP tools to sizes as small as 200 microns, enabling highly localized spot treatments for damage mitigation, debris removal and chemical modification. For example, we have engineered our RAP source to selectively remove unwanted deposits and residue from the edges of optics and semiconductor wafers. These deposits cannot be removed by conventional full-aperture plasma cleaning tools.
In a second example, we have shown that RAP can be used to mitigate damage sites on the surface of high-damage threshold laser optics.
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| We have also reversed the chemistry of the RAP process to deposit coatings. In this way we can selectively and precisely add or remove material on a surface. |
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